| Types: |
Single- and double-sided printed circuit boards, as well as multilayer boards of up to 20 layers |
| Base Material:
| FLEX
CEM 1
TEFLON
FR4
Standard
FR4 HighTG
Rogers 3450
Rogers 4003
Polyimide |
Conductor Geometry:
Conductor Spacing:
Number of Layers:
Bore Diameter: |
Conductor width: >= 100 micron
> 100 micron
till 20 Layers
>= 0,15
mm |
| Surfaces:
|
 Selectively tin-plated, lead-free in HASL process
Selectively tin-plated HASL process
Chem. tin
Chem. nickel/gold
bondable gold surface (also for thermosonic
 bonding)
Galv. tin entire surface
Galv. nickel/gold (also selective)
Carbon ink
Solder resist coating photosensitive in slot curtain
coating or in screen printing for special
applications
Removable soldering mask |
| Contour processing:
|
Milling, Cutting, Punching |
| |
|
| Motivated employees: |
 |
| |
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