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Query Form:

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 Leiterplatte:

Specification

Number of Layers *
Basic Material *
Material Thickness *
[mm]
Cu-Layers *
[µm]
Data:
Contour: milled scoring
Number of drilling *:

Drilling Change / Drill head change:
- x Change

minimum Drill Diameter-Ø:
[mm]
maximium Drill Diameter-Ø:
[mm]
SMD-Technik:
no one-sided double-sided  
Number of SMD-Pads:

Surfaces

HAL Pb/Sn        HAL lead-free        Chem. Ni/Au        Chem. Sn        Entek

Assembly-Layers:
Number of mask printing:
Number of Au-Connections:
Pieces
Position of Au-Connections:
outside      inside
Strippable Varnish Carbon print Durchsteigerfüller

Layout

min. Conductor thickness [mil] min. Conductor distance [mil]
E-Test *:
Value-Form:
Amount *:

Stk.

Stk.

Stk.

Appointed Week:

  Week

  Week

  Week

Fast Delivery:
Delivery Time:

Miscellaneous Wishes

Adresser

Company
Account Number
Contact person
Street
Postcode
E-Mail
Phone:
Fax-Nr:
Date